Company record
Pac Tech USA - Packaging Technologies, Inc. designs and builds equipment for wafer bumping, packaging, and solder‑ball placement. Its portfolio includes systems for solder bumping and rework, plating solutions, backend and assembly lines, laser‑assisted solder jetting devices, wafer‑level solder‑balling machines, and assembly and laser‑marking tools for photovoltaic applications. These technologies are supplied to customers in wafer‑level packaging, backend processing, as well as the defense and medical sectors.
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