Company record
Clover Stamping, Inc. specializes in precision stamping and produces custom‑engineered components for semiconductor and electronic applications, ranging from solid‑state relay parts to lead frames, connectors, miniature jumpers and heat sinks. It offers a full suite of in‑house tooling capabilities, including design, fabrication and ongoing maintenance throughout the project lifecycle. Stamping thicknesses can be as thin as 0.002 in and as thick as 0.125 in. The material portfolio comprises high‑ and low‑carbon steel, aluminum, phosphor‑bronze copper, bronze, brass, beryllium‑copper (BeCu), stainless steel and nickel.
This directory record does not yet have a linked material-flow brief.