Company record
Avantec Mfg., Inc. delivers full‑service contract electronics manufacturing, focusing on the assembly of printed circuit boards, complete box‑builds and comprehensive testing. The operation holds ISO 9001:2000 certification and supports BGA, surface‑mount (SMT), through‑hole and mixed‑technology assemblies for both turnkey and consignment projects. Through‑hole components are joined using the Electrovert Econopack wave‑soldering system, and every flux employed in the process is water‑soluble. The surface‑mount line features automated pick‑and‑place machines from Amistar® and accommodates fine‑pitch parts with 12 mil spacing, ranging from 0402 passive components to 54 × 54 mm QFPs supplied by Philips®. Avantec also provides prototyping, cable and harness assembly, ICT/functional testing and conformal coating services. All assemblies are lead‑free and meet IPC‑A‑610 and J‑STD‑001 standards.
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