Company record
Plansee Thermal Management Solutions provides controlled‑expansion, high‑thermal‑conductivity metal matrix composites, advanced ceramics, and fully engineered packages and assemblies. Its product portfolio spans accelerometers, carriers and plates, fiber‑optic packages, flip‑chip lids, hermetic enclosures and housings, high‑reliability and high‑speed packages, laser‑diode substrate mounts and blocks, multi‑layer co‑fired ceramic packages, point‑to‑point radio housings, RF‑transistor flanges and bases, as well as RF‑transistor packages and seal frames.
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