Company record
Bullen Ultrasonics delivers precision ultrasonic machining for a broad spectrum of hard and brittle substrates, including silicon carbide, silicon nitride, piezoceramics, fused quartz, standard and borosilicate glass, single‑crystal and polycrystalline silicon, sapphire, various carbides, composites, and related materials. The company also supports silicon fabrication workflows, offering crystal growth, cropping, outer‑diameter grinding, wire slicing, edge grinding, as well as cleaning and annealing processes that convert crystals into blanks or wafers. In addition, Bullen Ultrasonics provides lapping and polishing services together with both ultrasonic and CNC machining capabilities, covering the full range from prototype development to full‑scale production. Its customer base spans the semiconductor, aerospace, automotive, communications, and electronics sectors.
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