Company record
IceMOS Technology Corporation manufactures electronic components, notably superjunction MOSFETs, and supplies a comprehensive portfolio of advanced wafers for the semiconductor sector. Its product line includes silicon‑on‑insulator (SOI), silicon‑silicon direct bonded (SiSi), double‑sided polished (DSP), drain/source on insulator (DSOI), cavity silicon‑on‑insulator (C‑SOI), through‑silicon‑via (TSV) and thin silicon‑on‑insulator (TSOI) wafers. In addition to wafer sales, IceMOS offers foundry operations, wafer‑bonding, deep reactive ion etching (DRIE), and wafer‑shaping services, supporting a broad range of semiconductor industry applications.
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