Company record
AmTECH Microelectronics, Inc. delivers ISO 9000:2001 certified contract manufacturing for printed circuit board (PCB) assemblies and advanced packaging. The company’s PCB assembly portfolio spans both surface‑mount technology (SMT) and plated‑through‑hole (PTH) processes, handling components as small as 01005 and 0201, as well as uBGA, CSP, QFN and fine‑pitch connectors, all under RoHS‑compliant fabrication, component sourcing, and assembly procedures. In the packaging arena, AmTECH offers integrated services that include IC assembly, chip‑on‑board (COB), chip‑on‑flex (COF), system‑in‑package (SiP) and multichip modules (MCM), employing fine‑pitch wire bonding options such as aluminum wedge, gold wedge, or gold ball. Its customer base spans the telecommunications, defense, medical, aerospace and automobile sectors, and the firm is capable of producing products that meet MIL‑STD‑883 specifications.
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