Company record
Plasma Ruggedized Solutions delivers advanced surface‑treatment and protection services for printed circuit boards. The organization holds AS9100 and ISO 9001:2008 certifications and is qualified for Federal Information Processing Standard (FIPS) projects, while also meeting AQMD and RoHS requirements for lead‑free manufacturing. Its portfolio includes conformal coating, parylene XY deposition, encapsulation, potting, plasma etch‑back and desmear processes, as well as the production of formed‑in‑place gaskets and laboratory testing. In addition, Plasma Ruggedized Solutions provides Ball Grid Array (BGA) underfill services tailored to PCB applications. Customers span a broad range of sectors, including alternate energy, aerospace and defense, medical, automotive, semiconductor, financial services, government, security, petrochemical and sports industries.
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