Company record
First Level Inc. operates a contract assembly facility featuring Class 10,000 ESD protected cleanrooms and concentrates on first‑level microelectronics packaging, encompassing die attach, wire bonding and component assembly. Expert engineers together with highly skilled technicians deliver design, process development and manufacturing services. The firm supports the medical, automotive, optoelectronics, light engine, military, aerospace and microwave sectors. Its product portfolio includes chip carriers, interposers, hybrid assemblies, multichip modules and custom modules.
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