Company record
General Technology Corp. delivers printed circuit board (PCB) fabrication for low‑volume orders ranging from one to one hundred units, with lead times that can be as short as 24 hours or extend to four weeks. The company produces both double‑sided and multilayer boards up to 20 layers, complying with NHB 5300.4(3I) and Mil‑P‑55110 specifications for glass‑filled (GF), glass‑filled high‑temperature (GH), and glass‑filled intermediate (GI) substrates, as well as for PTFE and Duroid materials. Additional PCB capabilities include surface‑mount technology (SMT), SMOBC, heat‑sink integration, bondable gold finishes, modem assemblies, and FTP options. In the contract electronic assembly arena, General Technology Corp. assembles black‑box modules, chassis, and a variety of cable assemblies that encompass fiber‑optic connections. The firm also constructs wiring harnesses, SMT‑populated PCBs, and full panels, adhering to NHB 5300.4(3A‑2) and Mil‑Std‑2000 standards. Services extend to conformal coating application, functional testing, turnkey project delivery, and strict ESD compliance, all supported by an ISO 9002 quality management system. Beyond hardware, General Technology Corp. provides contract personnel solutions, supplying both temporary and permanent technical staff to operate directly at customer sites.
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