Company record
GradConn manufactures a portfolio of interconnect solutions that includes SIM connectors, micro‑USB connectors, and coaxial cable assemblies. The product line also covers a comprehensive selection of board‑to‑board connectors with pitches of 0.8 mm × 1.2 mm, 1.0 mm, 1.27 mm, 2.0 mm, 1.27 mm × 2.54 mm, 2.54 mm, 3.96 mm and 5.08 mm. In addition, GradConn offers wire‑to‑board options such as PCB headers and cable assemblies engineered for 0.8 mm and 1.00 mm pitch applications.
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