Key facts
- Listed location
San Jose, California, USA- Company type
- Custom Manufacturer
- Company size
- Micro (1-10)
- Founded
- 1992
Company record
American Precision Dicing, Inc. provides laser marking and engraving solutions for the semiconductor sector and offers glass wafer coring, etching, and precision dicing services. It works with a variety of materials such as acrylic, glass, polymer, aluminum, stainless steel, ceramic and quartz.
Listed capabilities
- Dicing Services
- Fiber Wafer Dicing Services
- Glass Wafer Dicing Services
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