Key facts
- Listed location
Eaton, Ohio, USA
- Company type
- Custom Manufacturer
- Company size
- Medium (50-500)
- Founded
- 1971
Company record
Bullen Ultrasonics delivers precision ultrasonic machining for a broad spectrum of hard and brittle substrates, including silicon carbide, silicon nitride, piezoceramics, fused quartz, standard and borosilicate glass, single‑crystal and polycrystalline silicon, sapphire, various carbides, composites, and related materials. The company also supports silicon fabrication workflows, offering crystal growth, cropping, outer‑diameter grinding, wire slicing, edge grinding, as well as cleaning and annealing processes that convert crystals into blanks or wafers. In addition, Bullen Ultrasonics provides lapping and polishing services together with both ultrasonic and CNC machining capabilities, covering the full range from prototype development to full‑scale production. Its customer base spans the semiconductor, aerospace, automotive, communications, and electronics sectors.
Listed capabilities
- Blank Crystals
- Glass & Ceramic Ultrasonic Machining
- Ground & Polished Glass
- High Purity Silicon
- Optical Silicon
- Piezoelectric Ceramic Machining
- Piezoelectric Ceramics
- Precise Movement Piezoelectric Ceramics
- Silicon Crystals
- Silicon Micromachining
- Silicon Wafer Grinding & Polishing Services
- Single Crystals
- Single Crystal Silicon
- Single Point Diamond Turning Crystals
- Strained Silicon
- Ultrasonic Machining
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