Company record
Surface Science Integration manufactures rapid thermal processing (RTP) and rapid thermal annealing (RTA) ovens for semiconductor manufacturing and research. Its portfolio includes RTP systems sized for 100 mm, 150 mm, and 200 mm wafers, as well as a standalone 150 mm ultraviolet (UV) unit. The equipment accommodates single wafers ranging from 2 in. to 8 in., delivers ramp‑up rates between 1 °C/s and 150 °C/s, and operates across a temperature window from ambient conditions up to 1,200 °C. Typical process capabilities cover ion‑implant activation, polysilicon annealing, oxide reflow, silicide formation, and contact alloying. Additional functions support oxidation, nitridation, pre‑gate oxidation cleaning, photoresist descum, and gallium arsenide (GaAs) processing.
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