Company record
Zymet provides a portfolio of microelectronics adhesives and encapsulants designed for high‑performance assembly. Its adhesive line includes electrically conductive, anisotropically conductive, thermally conductive, and low‑stress formulations that support die‑attach, substrate‑attach, and flip‑chip interconnections. The company also offers Glob‑Tap encapsulants tailored for chip‑on‑board (COB) and chip‑on‑film (COF) applications, as well as dedicated flip‑chip encapsulants.
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