Company record
MillPack, Inc. provides engineering, printed‑circuit‑board (PCB) design, manufacturing, and assembly solutions that span from basic surface‑mount layouts to intricate high‑density, high‑speed digital and RF/microwave configurations. The company’s capabilities encompass a range of advanced features, including stair‑stepped cavity substrates, stacked‑chip and flip‑chip architectures, wire‑bonding, as well as embedded passive components such as capacitors, inductors, and printed resistors. MillPack works with a broad material portfolio: standard FR‑4, flexible and rigid‑flex laminates, polyimide, BT, low‑temperature and high‑temperature co‑fired ceramics (LTCC and HTCC), alumina, aluminum nitride, beryllium oxide, both thick‑film and thin‑film coatings, metal housings equipped with feed‑throughs, substrates that incorporate brazed pins, and metal seal rings with lids.
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