Key facts
- Listed location
San Jose, California, USA- Company type
- Fabricator
- Company size
- Small (10-50)
- Founded
- 2005
Company record
Grinding and Dicing Services, Inc delivers wafer polishing and grinding solutions tailored to the semiconductor sector. Its portfolio also encompasses wafer dicing, metal polishing, automated inspection and comprehensive quality‑assurance processes, supporting customers in medical‑device, military and RF wireless markets.
Listed capabilities
- Wafer Plating
- Fiber Optics Fiber & Wafer Polishing
- Silicon Wafer Grinding & Polishing Services
- Wafer Grinding & Polishing Services
Similar companies
This directory record does not yet have a linked material-flow brief.