Key facts
- Listed location
Escondido, California, USA- Company type
- Manufacturer
- Company size
- Small (10-50)
- Founded
- 1980
Company record
Hybond, Inc. develops, manufactures and distributes wire bonders, die bonders, wire‑bonder testers and a full line of accessories for the worldwide production and repair of microcircuits. The wire‑bonder portfolio features ball bonders, wedge bonders capable of handling both wire and ribbon, and peg bonders designed for insulated wire, as well as equipment for bump coining and flex‑cable bonding. Die‑bonder offerings cover eutectic, epoxy and silver‑glass die‑attach solutions. Supporting accessories comprise heated work stages that accommodate parts of diverse shapes and sizes, along with microscopes, target markers and illuminators.
Listed capabilities
- Semiconductor Assembly Equipment
- Bonding Machinery
- Brake Bonding Machinery
- Die Bonders
- Lead Bonders
- Peg Bonders
- Ribbon Bonders
- Tape Automated (TAB) Bonders
- Ultrasonic Bonders
- Ultrasonic Soldering Equipment
- Wire Bonders
Similar companies
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