Key facts
- Listed location
Aurora, Nebraska, USA
- Company type
- Custom Manufacturer
- Company size
- Small (10-50)
- Founded
- 1973
Company record
International Sensor Systems designs and manufactures electronic printed‑circuit assemblies, offering multichip modules, thick‑film hybrid circuits, surface‑mount technology assemblies, chip‑on‑board and through‑hole configurations. Production capacity spans from low‑volume prototypes to high‑volume runs, with integrated environmental and burn‑in testing that includes functional verification at several stages of the manufacturing flow. Engineering support covers electrical power and environmental testing, CAD/CAM design, analysis of schematic bills of material, package requirements and the definition of environmental and test specifications. In‑process testing and inspection of multichip modules adhere to MIL‑STD‑883, while final assembly inspection follows IPC‑A‑610 Rev B standards. All testing is performed in accordance with MIL‑STD‑883D, and equipment calibration schedules and records are maintained with NIST‑traceable documentation. The company serves industrial, medical and military markets.
Listed capabilities
- Chip-on-Board Circuits
- Circuit Continuity Testing Services
- Hybrid Circuits
- In-Circuit Testing Services
- Integrated Circuit Assembly Services
- Multichip Modules (MCM)
- Printed Press Circuits
- Thick Film Hybrid Circuit Assemblies
- Thick Film Hybrid Circuits
- Thin Film Hybrid Circuits
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