Key facts
- Listed location
Willow Grove, Pennsylvania, USA- Company type
- Manufacturer
Company record
K & S Micro-Swiss supplies precision cutting tools and machinery tailored for semiconductor manufacturing processes. Its product line includes cutting, dicing and sizing equipment, as well as saws and gang‑arbor assemblies. The company also offers resin‑bonded and metal‑bonded diamond blades together with matching gang‑arbor assemblies. In addition, it designs and fabricates diamond dicing blades, flanges and complete semiconductor assembly systems. Available accessories encompass wafer dicer saws, die and wire bonders, capillaries for wire bonding, die collets, pick‑up tools, T.A.B. tools and other bonding components.
Listed capabilities
- Die Bonders
- Bonding Tools
- Capillaries
- Flip Chip Bonders
- Hot Air Bonders
- Hot Bonders
- Lead Bonders
- Peg Bonders
- RF Bonders
- Ribbon Bonders
- Tape Automated (TAB) Bonders
- Ultrasonic Bonders
- Wire Bonders
Similar companies
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