Key facts
- Listed location
Moorpark, California, USA
- Company type
- Manufacturer
- Company size
- Small (10-50)
- Founded
- 1982
Company record
Ultron Systems, Inc. provides OEM grade equipment and materials for semiconductor manufacturing, including tape applicators designed for dicing and grinding, UV cure systems, wafer cleaners, precision die bonders, substrate fracturers, expanders, pull testers, and specialized IC process tape.
Listed capabilities
- Die Bonders
- Flip Chip Bonders
- Wire Bonders
Similar companies
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