Texas Instruments Incorporated

Analog and embedded semiconductors, 300mm fabs and internal manufacturing capacity

Texas Instruments 2025 Annual Report covers its analog and embedded-processing business and manufacturing strategy. TI says its environmental program manages materials and chemicals, and reports that water-reduction projects implemented in 2024 saved an annualized amount equal to 3.5% of 2023 usage. Public sources do not establish one fab-level mass balance for water, chemical recovery, wafer scrap and product output.

2025 Annual report and manufacturing disclosure

Analog and embedded Core product platforms

300mm High-volume wafer manufacturing platform

3.5% Annualized water savings from 2024 projects

• Silicon wafers, photoresists, specialty gases, acids, bases, solvents, metals and packaging inputs
• Ultrapure water, electricity, natural gas and cleanroom consumables
• Reclaimed water and recovered process materials where qualified

Outputs and residuals to resolve

• Analog and embedded semiconductors, wafers, packages and test output
• Wastewater, spent chemicals, wafer scrap, gases, packaging and cleanroom waste
• Fab-level recovery yield and customer-product allocation remain open

First decision: Select one 300mm fab and one process family. Map water, chemicals, gases, wafer scrap, packaging, reuse, recovery and yield in a single operating record.

Texas Instruments Incorporated is an analog and embedded-processing semiconductor company.

Manufacturing wedge

TI's 300mm wafer strategy creates a clear site-level operating context for water, chemistry and yield.

Water signal

TI reports that its water reuse rate rose from 31% to 35% in 2025 as 300mm production ramped in Utah and Texas.

Evidence boundary

The public water program is useful context. One fab-level material ledger still needs qualification.

Decision boundary

The public record supports one bounded next move: Select one 300mm fab and one process family. Map water, chemicals, gases, wafer scrap, packaging, reuse, recovery and yield in a single operating record. It does not establish a buyer, commercial approval or supply agreement.

This is a public screening map. It separates company-disclosed flows from open qualification work. It does not convert a destination into a buyer or an announced ambition into operating capacity.

Turn the water project into a fab decision

A company-level percentage becomes useful when tied to a process, equipment change and measured outcome.

Next evidence: Name fab, process, project, baseline, saved volume and reporting boundary.

Qualify chemical recovery with EHS first

Recovery is not automatically a good idea in a semiconductor process. Purity, safety and reliability decide.

Next evidence: Map input chemistry, recovery unit, quality test, reuse point and residual route.

Connect 300mm yield to material efficiency

Higher yield can reduce material demand without changing the customer specification.

Next evidence: Join wafer starts, defect classes, process inputs, scrap and product output for one line.

• 2025 Annual Report Texas Instruments, official investor reporting https://investor.ti.com/financial-information/earnings-annual-reports
• 2025 Annual Report PDF Texas Instruments, official annual report https://investor.ti.com/static-files/fc9d9346-cf77-40db-902a-e9961e9c5736
• Environmental sustainability Texas Instruments, current environmental disclosure https://www.ti.com/about-ti/citizenship-community/environmental-sustainability.html
• Corporate Citizenship Report 2025 Texas Instruments, official water-reuse and material-reclamation disclosure https://www.ti.com/lit/ml/szzo174/szzo174.pdf

Source hierarchy: filings and company disclosures first. The brief states what those sources support and leaves the unresolved plant, grade, permit, buyer and mass-balance questions explicit.

Texas Instruments has an unusually concrete materials-transition opening: 300mm wafer manufacturing, water-reduction projects, process chemicals and internal capacity. The first lane is one fab where water, chemistry, scrap and product yield can be managed as one operating system. The next useful working session starts with: Select one 300mm fab and one process family. Map water, chemicals, gases, wafer scrap, packaging, reuse, recovery and yield in a single operating record.